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Wieson Group to Showcase High-Speed Products for Cloud Computing and Data Communication at 2025 DesignCon

 

Wieson Group, a leading provider of interconnect components, wireless components, and automotive electronics, will exhibit at DesignCon 2025 on January 29-30 in Santa Clara, USA. With over 30 years of expertise in mechatronic integration, Wieson serves industries including computing, telecommunications, consumer electronics, healthcare, industrial control, and automotive, consistently driving innovation and excellence.

Booth Number: 805

Highlighted products on display include:

• MCIO Cable & Connector
• Multi- Trak Cable & Connector
• DA-CEM Connector
• U.2 Connector
• GEN Z Cable
• SFP、QSFP Cable

Wieson is committed to delivering standardized products and customized solutions through its strong R&D capabilities and automated production equipment. By continually enhancing quality and efficiency, the company has become the ideal partner for its clients. The showcased products are specifically designed for applications in cloud computing and data communication, meeting the demands for high-speed, reliable, and efficient solutions.

We warmly invite you to visit our booth and explore the future of high-speed connectivity innovation with Wieson Group!

DesignCon 2025


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