Powering AI, Cloud Computing, and Advanced Display Applications

Wieson Group will exhibit at DesignCon 2026, held February 24–26, 2026, in Santa Clara, California, showcasing a broad portfolio of high-speed interconnect and advanced display interface solutions designed for AI computing, cloud data centers, and next-generation systems.

Booth 809

At DesignCon 2026, Wieson will highlight technologies enabling higher bandwidth, lower loss, and greater system scalability, addressing key applications such as AI accelerators, servers, storage, networking, and high-resolution displays. Featured products include:

• MCIO Cable & Connector
• Multi-Trak Cable & Connector
• DA-CEM Connector
• U.2 Connector
• GEN Z Cable
• SFP / QSFP Cable
• HDMI CAT4 Connector & Cable
• DP 2.1 Connector & Cable

With comprehensive product offerings and strong system integration capabilities, Wieson helps customers optimize performance, reliability, and design flexibility, accelerating time-to-market for next-generation applications.

Visit Booth 809 at DesignCon 2026 to explore how Wieson is enabling the future of high-speed connectivity and advanced display technologies.

DesignCon 2026