Wieson Technologies will participate in COMPUTEX 2026, taking place from June 2 to June 5, 2026, at Taipei Nangang Exhibition Center, Hall 1, Booth I1003. This year’s exhibition will focus on high-speed transmission and AI server applications, integrating connector and thermal technologies to demonstrate key infrastructure capabilities for the high-performance computing era.

As demand for AI, cloud computing, and data centers continues to grow rapidly, high-speed data transmission and efficient thermal management have become critical to overall system performance. At this year’s show, Wieson will highlight its comprehensive high-speed connectivity solutions, including a wide range of high-speed connectors and cable products. The lineup also features the latest HDMI CAT4 Connector & Cable and DisplayPort 2.1 Connector & Cable, both certified by official associations, supporting high bandwidth, ultra-high-resolution display, and high-speed data transmission for AI computing, data centers, and advanced display applications.

In terms of thermal technology, Wieson will present its full Thermal Solution portfolio, targeting AI servers and high-performance computing (HPC) applications. The showcase includes GPU thermal modules, server thermal modules, and liquid cooling solutions. By leveraging heat pipe design, optimized metal materials, and advanced liquid cooling technologies, these solutions effectively enhance heat dissipation efficiency and system stability for high-power computing platforms, meeting the demands of next-generation AI and high-density data center environments.

In addition, Wieson will also exhibit a range of industrial connectors, demonstrating highly reliable connectivity solutions for harsh environments. These products offer excellent resistance to water, dust, and environmental stress, making them suitable for outdoor equipment, industrial control systems, smart manufacturing, and edge computing devices. They ensure stable performance under high temperature, high humidity, and vibration conditions, further extending high-speed connectivity into diverse application scenarios.

Through the integration of high-speed connectivity, thermal management, and industrial-grade technologies, Wieson not only provides critical components but also strengthens its system-level integration capabilities, helping customers build high-performance and highly reliable total solutions.

Wieson Technologies stated that the company will continue to invest in R&D for high-speed transmission and thermal technologies, while enhancing its customization and integration capabilities to address the rapid evolution of AI, edge computing, and HPC markets. Through COMPUTEX 2026, Wieson looks forward to engaging with global customers and partners to explore new opportunities in next-generation computing and connectivity.

Wieson Technologies sincerely invites you to visit Booth I1003, Hall 1, Taipei Nangang Exhibition Center.

Exhibition Information

Exhibition
Computex 2026

Date
June 2 – 5, 2026

Opening Hours
June 2 – 4 | 09:30 – 17:30
June 5  | 09:30 – 15:30  

Venue
Taipei Nangang Exhibition Center, Hall 1, 1F

Booth Number
I1003

Exhibition products

．PCIe 6.0& 7.0 High-speed transmission
．HDMI CAT4 & DisplayPort 2.1 certified products and long-distance high-speed transmission solutions
．GPU thermal modules / Server thermal solutions
．Liquid cooling solutions
．Waterproof and industrial connector solutions

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