With the deepening of industrial automation, AI, autonomous mobile robots (AMR), and humanoid robots are gradually moving from R&D validation into factories, logistics, and service environments. This trend drives the demand for related components to be highly reliable, high-speed, high-power, and highly integrated. Wieson Technologies will strategically position itself with "Connection × Data × Power × Thermal" as its core, focusing on key applications such as robot joints, motor drives, sensors, controllers, machine vision, and edge AI computing. The company will enhance its signal, power, and communication connection solutions, while extending its high-speed data transmission and thermal management technologies to meet the real-time computing, precise control, and long-term stability requirements of next-generation robots. By integrating these four technical capabilities, Wieson plans to evolve from a single-component supplier to an integrated solution provider, continuing to expand its presence in the industrial, mobile, and humanoid robotics markets.

Currently, High Bandwidth Memory (HBM) for AI servers is consuming a massive amount of wafer capacity, and memory suppliers are shifting their focus to enterprise-grade products. This has caused a structural shortage of consumer-grade GDDR video memory, affecting PC and laptop shipments and increasing PC costs. In response to market changes, Wieson's Thermal Management Division continues to advance its technology development. For the Intel LGA9324 series CPUs and AMD SP8 series CPUs scheduled for release in Q4 2026, Wieson has already completed the testing and validation of corresponding server CPU thermal management solutions. Furthermore, addressing the cooling requirements for PCIe and OAM architecture GPUs or ASICs in AI computing, the R&D team provides customized thermal simulation analysis and develops both active and passive cooling modules. To meet the thermal management target of up to 800W for next-generation consumer graphics cards, Wieson has also developed air-cooling and AIO liquid cooling modules (WATERCOOLER), offering customers a diverse range of cooling options.

Wieson continues to invest in high-frequency and high-speed product development and automated production process upgrades for the Server, Storage, IPC, and HPC markets. To further upgrade its high-speed transmission connector analysis and manufacturing technologies, the company has invested in 67G high-frequency network analyzers and automated testing equipment. This ensures compliance with customers' strict requirements for signal stability and data transmission speed across different application environments, providing highly stable and low-loss product options, and assisting customers in the smooth development and mass production of next-generation products.