Since its establishment in 1990, Wieson Technologies has upheld a spirit of professionalism and innovation. Starting with the design and manufacture of connectors and cable assemblies, we have steadily expanded into diversified product lines covering high-speed transmission and wireless communication. With over three decades of accumulated R&D and production experience, we have built a solid manufacturing foundation and successfully integrated group resources to develop various subsystem electronic solutions, fully advancing into the intelligent application landscape.
With high-speed signal and wireless transmission technologies as our core strengths, Wieson actively invests in connectivity solutions for emerging applications such as artificial intelligence (AI), cloud computing, and edge computing. Our products are widely used in:
In response to rapidly changing market trends, Wieson continues to pursue technological breakthroughs and process upgrades. We possess key capabilities in in-house mold design, precision injection molding, antenna modules, thermal solutions, and circuit integration. We have also implemented intelligent manufacturing systems and green production practices, delivering high-quality, efficient, and sustainable solutions for our global customers.
More than just a component supplier, Wieson is committed to becoming a trusted technology partner worldwide. Looking ahead, we will continue to expand our global footprint, deepen R&D efforts, and collaborate with our clients to build a smarter, more efficient digital future.

• High speed and high frequency
• Precision mechanical
• Precision tooling
• Verification & testing
• Water-proof technology
• Auto assembly
| Mechanical Design | Mechanical Simulation & Analysis | Circuit Design | H/S Signal Analysis | Electrical Signal Analysis |
|---|---|---|---|---|
| .2D drawing | .Structure analysis Normal force, insertion force, stress distribution, deformation |
.Circuit design | .Scatter parameters | .Circuit cascade |
| .3D drawing | .Injection simulation Filling, holding pressure, cooling, warpage control |
.PCB design | .Current distribution | .Circuit embedded and de-embeddded |
| .Mechanical design | .BOM management | .Radiation pattern | .Scatter parameters | |
| .Network management | .Eye-diagram |
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